I think there’s more to it - IIRC, this is Intel’s factory

Things that can mess up a batch- clean room not clean enough, vibrations from walking/vehicles/tectonic activity/lack of mechanical precision, temperature variations, impurities in chemicals or wafers, em interference, static charges, etc

We’re talking a few dozen atoms in the wrong place, the tolerances are minuscule when you’re making modern chips. A small problem in the supply chain, process, or the building itself could all kill your yield

I’m not an expert or anything, but I know this is a very unforgiving field

TSMC and Intel both use ASML lithography, but there are many many more steps than just lithography - Intel, TSMC, Samsung and other chipmakers use different processes to make the components on their chips (many of which are patented and so owned by specific parties).

These things include the physical structure of the components and wiring on the chip, how the silicon is doped and with what ions, what coatings are put on to be etched in the lithography and what coatings are applied to the etched layers, how the chips are packaged and also how multiple chips can be combined into one package.

Basically there are similarities but also hige differences between the different manufacturers, and a lot of trade secrets.

If you're interested in this kind of thing, I'd recommend the youtube channel Asianometry - the content creator is amazing.

I have no idea about anything at all, but part of me wants to see this be the result of some predictable, stupid mistake, like a unit conversion error or something, and another part of me wants it to be something totally unpredictable, like some unique gravitational anomaly or some latent radiation of some kind, like, something with muons.

TSMC uses the same lithography and same wafers and gets working chips. It's the fab process. Is it fixable? Idk.

Bad craftsmen always blame their tools